HS-Udimm-FUTURE

Manufacturer reference

Manufacturer details describe the cited version. Confirm the exact unit and intended system.

Product type

UDIMM memory module with heatsink for desktops (FUTURE series)

Type

Udimm

Capacity

8 GB | 16 GB | 32 GB | 8 GB × 2 | 16 GB × 2 | 32 GB × 2

Interface

DDR4/DDR5

Frequency

3200 / 3600 / 4000 / 6000 / 6400 / 6800 / 7200 / 7600 / 8000 MHz

Pin

288pin

Size (L×W×H mm)

133.25 × 31.25 × 1.4 / 133.25 × 31.25 × 3.77

Operating temperature

0 °C to 85 °C (32 °F to 185 °F)

Weight

70 g / 70 g × 2

Appearance

Heatsink

Applications

Consumer

Part numbers (supplier list)

HSC408U32C2 (FUTURE U10 DDR4 3200 MHz 8 GB); HSC416U32C2 (DDR4 3200 MHz 16 GB); HSC516U48C2 (DDR5 4800 MHz 16 GB); HSC516U56C2 (DDR5 5600 MHz 16 GB); HSC516U60C2 (DDR5 6000 MHz 16 GB); HSC516U64C2 (DDR5 6400 MHz, capacity to confirm)

Selection notes

• Specifications are from the HIKSEMI official product page for HS-Udimm-FUTURE (www.hiksemitech.com).
• The part numbers row lists the items in the supplier list for this series; the official page describes the series as a whole. Confirm the part number, capacity and speed with ISD.
• ISD stock, price, Malaysian warranty and delivery are confirmed separately. Confirm the exact model suffix and supplied revision.

Official documents

• ISD datasheet (PDF): HIKSEMI HS-Udimm-FUTURE
• HIKSEMI official product page

Manufacturer source checked 2026-11-02. The supplied unit and local terms require confirmation.